Bumps OP-TEE examples package version to OP-TEE release 4.2.0. Signed-off-by: Nayab Sayed <nayabbasha.sayed@microchip.com> Signed-off-by: Thomas Petazzoni <thomas.petazzoni@bootlin.com>
Bumps OP-TEE examples package version to OP-TEE release 4.2.0. Signed-off-by: Nayab Sayed <nayabbasha.sayed@microchip.com> Signed-off-by: Thomas Petazzoni <thomas.petazzoni@bootlin.com>